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Flow & Transfer

Heat Transfer Enhancement of Syrup Vertical Falling-film Evaporation by Spiral Inserts

  • Deqi PENG Lanwei CHEN Haisong LUO Tianlan YU Kang CHEN Hao LI Yuye HAN
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  • 1. School of Mechanical Engineering, Xiangtan University, Xiangtan, Hunan 411105, China; 2. School of Mechanical Engineering, Hunan University of Technology, Zhuzhou, Hunan 412007, China

Received date: 2017-02-13

  Revised date: 2017-04-20

  Online published: 2017-12-05

Abstract

The new form of vertical single tube steam-syrup falling film evaporation experimental platform was built to study the heat transfer performance of inserting the specific structure and technological parameters’ spiral in tube for the viscous syrup falling film evaporation, and conducting the 4 h comparative syrup falling film evaporation experiment for added and no added spiral. The results showed that inserting spiral has obviously effect on improving the heat transfer performance of syrup falling film evaporation, under the same experimental conditions, the total heat transfer coefficient improved 25.9%~82.9% than that inserted nothing, and the decline rate of total heat transfer coefficient with time was lower apparently. When the heat transfer temperature difference increased, the heat transfer of the evaporation side for inner tube get better but the condensation side for outer tube get deterioration, material physical properties changes (viscosity reduction) can enhanced heat transfer effect by increasing the heat transfer temperature difference. In the non-fouling affected heat transfer period, further processed was made for the evaporation side heat transfer coefficient, which obtaining the correlation between the inner tube comprehensive heat transfer coefficient and heat transfer temperature difference.

Cite this article

Deqi PENG Lanwei CHEN Haisong LUO Tianlan YU Kang CHEN Hao LI Yuye HAN . Heat Transfer Enhancement of Syrup Vertical Falling-film Evaporation by Spiral Inserts[J]. The Chinese Journal of Process Engineering, 2017 , 17(6) : 1134 -1139 . DOI: 10.12034/j.issn.1009-606X.217133

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