A coupling double-distribution model was developed for simulating natural convection of porous media containing electronic chips based on the lattice Boltzmann method. The effects of different physical parameters on the natural convection of porous media were studied, and the obtained results were compared with the previous literature’s data to verify the feasibility and reliability of the current model. On this basis, effects of the size of the single electronic chip, the layout of the multiple chips, and the surface temperature fluctuation of the single chip on the heat transfer performance of the surface of the electronic chip had been comprehensively investigated. In addition, in order to quantitatively analyze the influence of various parameters on heat dissipation of the electronic chip, the average Nusselt number was employed to evaluate the heat transfer performance, and the following results were obtained: regarding the natural convection inside the porous media with a single chip under a constant temperature boundary condition had a critical chip size at Da=10-2. Under the condition of critical chip size, the distribution of the flow field was quite stronger compared with the case of a chip with a smaller size, but the heat transfer performance was almost the same. When Ra=103, the critical chip size was 0.203125 times the cavity side length, and the critical chip size was 0.25 times the cavity side length at Ra=104. And the critical chip size was 0.390625 times the cavity side length at Ra=105. When the permeability of porous media decreased, the critical chip size did not exist, and the average Nusselt number in the chip surface and the cold wall increased accordingly. For the natural convection occurred in a constant-temperature porous media with multiple-chips, the horizontal arrangement of the chips can present a high heat transfer ratio in the case of porous medium with large permeability (Da=10?2), while for the porous media with small permeability (Da=10?4), the chip layout should be diagonally distributed.
Yue CHEN Ming MA Ying ZHANG Hailong GUO Qikun WAN
. Lattice Boltzmann numerical simulation of flow thermal coupling in porous media with electronic chips[J]. The Chinese Journal of Process Engineering, 2020
, 20(2)
: 123
-132
.
DOI: 10.12034/j.issn.1009-606X.219169
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