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Thermal Property of Decanoic Acid-Palmitic Acid/SiO2 Composite Phase Change Material

  • ZHANG Hao LIU Xiu-yu ZONG Zhi-fang ZHU Qing-ming LIN Xiao-fei
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  • School of Civil Engineering and Architecture, Anhui University of Technology School of Civil Engineering and Architecture, Anhui University of Technology School of Civil Engineering and Architecture, Anhui University of Technology School of Civil Engineering and Architecture, Anhui University of Technology School of Civil Engineering and Architecture, Anhui University of Technology

Received date: 2015-06-29

  Revised date: 2015-07-29

  Online published: 2015-10-20

Abstract

Using SiO2 as carrier and decanoic acid-palmitic acid as phase change material, decanoic acid-palmitic acid/SiO2 composite phase change material was prepared by sol-gel method, its thermal storage and thermal conductivity performances, microstructure and composition structure were characterized. The results show that when the amount of decanoic acid-palmitic acid is 0.08 mol, the preapred material haa the best thermal storage performance, such as phase change temperature is 20.02~22.08℃ and phase transition enthalpy 44.53~50.51 J/g, being suitable for application in the field of architecture. When the amount of decanoic acid-palmitic acid is 0.06 mol, the material has the best thermal conductivity performance, such as its thermal conductivity in the first stage of cooling is 0.211 W/(m×K), 0.017 W/(m×K) in the stage of phase plateau and 0.040 W/(m×K) in the second stage of cooling. SiO2 in the material is physically embedded with decanoic acid-palmitic acid, there is no chemical reaction between them. When the content of decanoic acid-palmitic acid is excessive, by which SiO2 is covered, the thermal storage and thermal conductivity performances are decreased.

Cite this article

ZHANG Hao LIU Xiu-yu ZONG Zhi-fang ZHU Qing-ming LIN Xiao-fei . Thermal Property of Decanoic Acid-Palmitic Acid/SiO2 Composite Phase Change Material[J]. The Chinese Journal of Process Engineering, 2015 , 15(5) : 860 -865 . DOI: 10.12034/j.issn.1009-606X.215249

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