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Institute of Process Engineering,Chinese Academy of Sciences
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中文
Co-smelting of waste printed circuit boards and copper concentrates: distribution patterns of Sn, Pb, and Zn elements
Yan LIU Yunfeng ZHU Bo LI Yonggang WEI
The Chinese Journal of Process Engineering . 2026, (
10
): 1148 -1159 . DOI: 10.12034/j.issn.1009-606X.226011
