对乙二胺四乙酸二钠(EDTA×2Na)与酒石酸钾钠(TART)双络合化学镀铜液进行了电化学研究，考察了络合剂与2,2￠-联吡啶对阴、阳极极化反应的影响. 结果表明，化学镀铜阳极极化受电化学与扩散混合控制，阴极极化受扩散控制；EDTA×2Na与TART通过竞争络合与竞争放电影响极化反应，而2,2￠-联吡啶以弥散吸附方式改变极化阻抗影响铜的沉积；在优化镀液(EDTA×2Na 13.35 g/L, TART 13.35 g/L, 2,2￠-联吡啶15 mg/L)中化学镀铜，镀速达14.83 mg/min，所得镀层均匀致密.

The electroless copper plating solution containing ethylenediaminetetraacetic acid disodium salt (EDTA×2Na) and potassium sodium tartrate (TART) as complexing agents was measured by electrochemical workstation, and the effects of complexing agents and 2,2￠-bipyridine on cathode and anode polarization were examined. The results show that the anodic reaction is controlled by both chemical reaction and diffusion, while the cathodic reaction is mainly controlled by diffusion. Through the complexation competition and discharge competition between them, EDTA×2Na and TART affect the polarization. The diffuse electrical double layer on the surface of the electrode is affected by 2,2￠-bipyridine through adsorption and AC impedance, which ultimately impacts the copper deposition reaction. Under the optimum solution composition of 13.35 g/L of EDTA×2Na, 13.35 g/L of TART and 15 mg/L of 2,2′-dipyridyl, the average deposition rate can reach 14.83 mg/min. The copper film deposited on substrate has excellent properties.