热解技术在处理废弃电路板，回收电路板中的金属，实现树脂、玻璃纤维等非金属成分的资源化方面发挥愈来愈重要的作用，但目前对于不含任何电子元件、含少量铜箔的废弃环氧树脂电路板的热解机理研究尚不明确。为阐述其热解催化作用，采用同步热分析仪和气相色谱-质谱联用(GC-MS)仪对不同升温速率(5, 10, 15, 20℃/min)下电路板的热解特性及热解机理进行分析。结果表明，废弃电路板热解过程主要分为四个阶段：表面残余水蒸发或其他小分子散逸、环氧树脂侧链基团氧化、四溴双酚A的分解和热解残留物分解；运用Kissinger法、Flynn-Wall-Ozawa法及Friedman法等明确单一反应的热解区间并求解热分解反应动力学参数，最终得到指前因子1.14×1022 min-1和活化能218.533 kJ/mol；采用?atava-?esták法和主曲线法进行机理函数对比分析，最终表明废弃环氧树脂电路板适用随机成核与增长模型：Avrami-Erofeev方程模化。研究结果可为促进热解技术的应用提供理论支撑。

The pyrolysis characteristics and pyrolysis mechanism of waste epoxy resin circuit boards containing a small amount of copper foil are mostly studied by a single "model matching method". To illustrate its pyrolysis catalysis, the pyrolysis characteristics and pyrolysis mechanism of the screened samples were analyzed by synchronous thermal analyzer and gas chromatography-mass spectrometry (GC-MS) at four different heating rates (5, 10, 15, 20℃/min), proposed a method to accurately calculate the "kinetic triplet". That is, firstly, two equal conversion methods were compared and analyzed to determine whether to follow a single pyrolysis reaction. Secondly, ?atava-?esták method and master curve method were used to select the appropriate mechanism model. Finally, the exact dynamic reaction order and mechanism function were obtained. The results showed that with the increase of heating rate, the residual residue in pyrolysis of waste circuit boards increased, indicating that the smaller the heating rate, the more complete the pyrolysis and the maximum rate of pyrolysis increased with the increase of heating rate. The pyrolysis process can be divided into four stages: the first stage (<150℃), evaporation of residual water on the surface or dissipation of other small molecules, the second stage (150~380℃), the third stage (380~500℃), the epoxy resin continued to decompose tetrabromobisphenol A, which formed small molecules and volatilized, and the fourth stage (>500℃), the pyrolysis residue decomposed slowly. Kissinger, Flynn-Wall-Ozawa and Friedman methods were used to solve the kinetic parameters of the thermal decomposition reaction of the sample, and finally the pre-exponential factor was 1.14×1022 min-1 and the activation energy was 218.533 kJ/mol. The mechanism function was compared and analyzed by ?atava-?esták method and master curve method, and finally the complete kinetic three factors were obtained. In addition, the relationship between activation energy and conversion rate proved that the waste epoxy resin circuit board can be modeled by Avrami-Erofeev equation (random nucleation and growth model) with reaction order of 5.4131: G(α)=[-ln(1-α)]5.4131.